A mold assembly for embossing thin products includes a first carrier with a female mold connected to an inside thereof and a second carrier with a male mold connected to an inside thereof. The female mold faces the male mold, and the thin product is sandwiched between the male and female molds. A window is defined through the first carrier and located corresponding to the apertures of the female mold so that the user may color the thin products via the apertures of the female mold before the products are removed from the mold assembly.