Invention Grant
- Patent Title: Package for a tire pressure sensor assembly
- Patent Title (中): 用于轮胎压力传感器组件的包装
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Application No.: US11144549Application Date: 2005-06-03
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Publication No.: US07281421B2Publication Date: 2007-10-16
- Inventor: Jeffrey Yin , Jen-Huang A. Chiou , John T. Meagher
- Applicant: Jeffrey Yin , Jen-Huang A. Chiou , John T. Meagher
- Applicant Address: US IL Deer Park
- Assignee: Temic Automotive of North America, Inc.
- Current Assignee: Temic Automotive of North America, Inc.
- Current Assignee Address: US IL Deer Park
- Agent Gary J. Cunningham
- Main IPC: G01M17/02
- IPC: G01M17/02

Abstract:
A tire pressure sensor assembly including a valve stem that can be preassembled and snap installed into a tire rim is disclosed. The tire pressure sensor assembly includes a valve stem and a printed circuit board configured with electronics for sensing tire pressure and transmitting radio frequency data related to tire pressure. The circuit board is rigidly connected to the valve stem. The valve stem and the electronics are contained in a unitary, integrated housing that is deformable to allow the valve stem portion of the assembly to be press fit into the rim opening. So installed, the assembly is securely mounted to the rim, but is no more time consuming to install than a conventional valve stem.
Public/Granted literature
- US20060272758A1 Package for a tire pressure sensor assembly Public/Granted day:2006-12-07
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