Invention Grant
- Patent Title: Method of molding a silica article
- Patent Title (中): 二氧化硅制品的成型方法
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Application No.: US10851023Application Date: 2004-05-21
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Publication No.: US07275397B2Publication Date: 2007-10-02
- Inventor: Terry L. Taft , Gary W. Wise
- Applicant: Terry L. Taft , Gary W. Wise
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agency: Siwen Chen
- Main IPC: C03B23/00
- IPC: C03B23/00 ; C03B9/34

Abstract:
Disclosed are high temperature free-flow mold for the production of near net-shape silica articles and method for the production of near net-shape silica articles. The mold is preferably made of graphite, preferably coated with SiC on the surfaces of the mold cavity. The mold and the process use no or less refractory elastic materials than that disclosed in the prior art, and does not alter or contaminate the glass composition. The mold the process are particularly suitable for the production of high purity silica articles for use in VUV and EUV lithographic devices.
Public/Granted literature
- US20050257568A1 Near net-shape high temperature free flow mold and method Public/Granted day:2005-11-24
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