发明授权
US07253061B2 Method of forming a gate insulator in group III-V nitride semiconductor devices
有权
在III-V族氮化物半导体器件中形成栅极绝缘体的方法
- 专利标题: Method of forming a gate insulator in group III-V nitride semiconductor devices
- 专利标题(中): 在III-V族氮化物半导体器件中形成栅极绝缘体的方法
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申请号: US11005193申请日: 2004-12-06
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公开(公告)号: US07253061B2公开(公告)日: 2007-08-07
- 发明人: Lung-Han Peng , Han-Ming Wu , Jing-Yi Lin
- 申请人: Lung-Han Peng , Han-Ming Wu , Jing-Yi Lin
- 申请人地址: TW Nantou
- 专利权人: Tekcore Co., Ltd.
- 当前专利权人: Tekcore Co., Ltd.
- 当前专利权人地址: TW Nantou
- 代理机构: Baker & McKenzie, LLP
- 代理商 David I. Roche
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A method of forming a gate insulator in the manufacture of a semiconductor device comprises conducting a photo-assisted electrochemical process to form a gate-insulating layer on a gallium nitride layer of the semiconductor device, wherein the gate-insulating layer includes gallium oxynitride and gallium oxide, and performing a rapid thermal annealing process. The photo-assisted electrochemical process uses an electrolyte bath including buffered CH3COOH at a pH between about 5.5 and 7.5. The rapid thermal annealing process is conducted in O2 environment at a temperature between about 500° C. and 800° C.
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