Invention Grant
- Patent Title: Temperature regulator of temperature regulating part under hopper of injection molding machine
- Patent Title (中): 注塑机料斗温度调节器温度调节器
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Application No.: US10859361Application Date: 2004-06-03
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Publication No.: US07249940B2Publication Date: 2007-07-31
- Inventor: Koji Senda , Hideki Koyama
- Applicant: Koji Senda , Hideki Koyama
- Applicant Address: JP Yamanashi
- Assignee: FANUC Ltd
- Current Assignee: FANUC Ltd
- Current Assignee Address: JP Yamanashi
- Agency: Staas & Halsey LLP
- Priority: JP2003-172185 20030617; JP2004-097709 20040330
- Main IPC: B29C45/78
- IPC: B29C45/78
Abstract:
A temperature regulator main body is connected to a cooling hole formed in a temperature regulating part under a hopper through a tube and comprises a tank for a cooling medium, a pump, a radiator, and a fan facing the radiator to send cold air and driven by a motor. By driving of the pump, the cooling medium circulates between the temperature regulating part under the hopper and the temperature regulator main body. A temperature sensor is provided to the temperature regulating part under the hopper. A controller for controlling an injection molding machine cools the circulating cooling medium by the fan and feedback controls the temperature of the temperature regulating part under the hopper when a temperature detected by the temperature sensor is higher than a preset temperature.
Public/Granted literature
- US20040258786A1 Temperature regulator of temperature regulating part under hopper of injection molding machine Public/Granted day:2004-12-23
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