A semiconductor element and a circuit substrate each having electrodes disposed at narrow pitch are electrically connected with high reliability by conductive paste. A semiconductor device with a semiconductor section and a circuit substrate electrically connected and a method for manufacturing such semiconductor device are provided. The manufacturing method includes processes of: forming semiconductor electrodes at the semiconductor section; forming substrate electrodes at the circuit substrate; firstly affixing one part of the semiconductor section and circuit substrate to an intermediate connector made of insulating material; forming via holes at intermediate connector according to positions of the semiconductor electrodes and positions of the substrate electrodes; electrically connecting each semiconductor electrode and each substrate electrode via each via hole; and secondly affixing the other part of the semiconductor section and circuit substrate to the intermediate connector.