Invention Grant
- Patent Title: Electronic component mounting apparatus and electronic component mounting method
- Patent Title (中): 电子元件安装装置和电子元件安装方法
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Application No.: US10857940Application Date: 2004-06-02
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Publication No.: US07246430B2Publication Date: 2007-07-24
- Inventor: Takahiro Yonezawa , Ken Kobayashi , Mikio Hasegawa , Hiroshi Nasu , Makoto Imanishi , Katsuhiko Watanabe
- Applicant: Takahiro Yonezawa , Ken Kobayashi , Mikio Hasegawa , Hiroshi Nasu , Makoto Imanishi , Katsuhiko Watanabe
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2003-157937 20030603; JP2004-103755 20040331; JP2004-103756 20040331
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.
Public/Granted literature
- US20050071991A1 Electronic component mounting apparatus and electronic component mounting method Public/Granted day:2005-04-07
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