Invention Grant
- Patent Title: Configuration and method for contacting circuit structure
- Patent Title (中): 接触电路结构的配置和方法
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Application No.: US10174057Application Date: 2002-06-17
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Publication No.: US07245026B2Publication Date: 2007-07-17
- Inventor: Rudolf Lehner
- Applicant: Rudolf Lehner
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: EP99125114 19991216
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A configuration and method for contacting a circuit is described. A carrier is disposed adjacent a circuit, and a setting element at which an electrical connection formed of a conductive material is disposed, so that the electrical connection connects the circuit to the carrier in a bonding process. In this manner an efficient and cost effective method for connecting the circuit to carrier is performed.
Public/Granted literature
- US20020173081A1 Configuration and method for the contacting of circuits Public/Granted day:2002-11-21
Information query
IPC分类:
