Invention Grant
US07209583B2 Bonding method, bonding apparatus and bonding program 失效
接合方法,接合装置和接合程序

Bonding method, bonding apparatus and bonding program
Abstract:
With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle θ2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle Δθ of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of Δθ.
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