Invention Grant
- Patent Title: Bonding method, bonding apparatus and bonding program
- Patent Title (中): 接合方法,接合装置和接合程序
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Application No.: US10959242Application Date: 2004-10-06
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Publication No.: US07209583B2Publication Date: 2007-04-24
- Inventor: Satoshi Enokido , Kenji Sugawara
- Applicant: Satoshi Enokido , Kenji Sugawara
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Shinkawa
- Current Assignee: Kabushiki Kaisha Shinkawa
- Current Assignee Address: JP Tokyo
- Agency: Koda & Androlia
- Priority: JP2003-348888 20031007
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle θ2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle Δθ of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of Δθ.
Public/Granted literature
- US20050167471A1 Bonding method, bonding apparatus and bonding program Public/Granted day:2005-08-04
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