Invention Grant
US07202563B2 Semiconductor device package having a semiconductor element with resin
有权
具有树脂的半导体元件的半导体器件封装
- Patent Title: Semiconductor device package having a semiconductor element with resin
- Patent Title (中): 具有树脂的半导体元件的半导体器件封装
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Application No.: US11088879Application Date: 2005-03-25
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Publication No.: US07202563B2Publication Date: 2007-04-10
- Inventor: Takashi Imoto , Chiaki Takubo , Ryuji Hosokawa , Yoshihisa Imori , Takao Sato , Tetsuya Kurosawa , Mika Kiritani
- Applicant: Takashi Imoto , Chiaki Takubo , Ryuji Hosokawa , Yoshihisa Imori , Takao Sato , Tetsuya Kurosawa , Mika Kiritani
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2004-089476 20040325
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/31
Abstract:
A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.
Public/Granted literature
- US20050212145A1 Semiconductor device and method of manufacturing the same Public/Granted day:2005-09-29
Information query
IPC分类:
