Invention Grant
US07197108B2 Method of fabricating X-ray mask and method of fabricating semiconductor device using the X-ray mask
失效
使用X射线掩模制造X射线掩模的方法和制造半导体器件的方法
- Patent Title: Method of fabricating X-ray mask and method of fabricating semiconductor device using the X-ray mask
- Patent Title (中): 使用X射线掩模制造X射线掩模的方法和制造半导体器件的方法
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Application No.: US10627611Application Date: 2003-07-28
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Publication No.: US07197108B2Publication Date: 2007-03-27
- Inventor: Hiroshi Watanabe , Koji Kise , Kenji Itoga
- Applicant: Hiroshi Watanabe , Koji Kise , Kenji Itoga
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2003-062939 20030310
- Main IPC: G21K5/00
- IPC: G21K5/00

Abstract:
In fabricating an X-ray mask, a chromium oxide film serving as an etching stopper is formed on a diamond film serving as an X-ray transmitter. Then, a diamond layer serving as a first X-ray absorber is formed on the chromium oxide film. Thereafter, a tungsten layer serving as a second X-ray absorber is formed on the diamond layer. Consequently, the diamond layer and the tungsten layer form an X-ray absorber having a laminated structure. When the X-ray absorber has a laminated structure including substances having different compositions, the transmittance and the phase shift quantity of the overall X-ray absorber can be readily adjusted. Thus, a method of fabricating an X-ray mask providing improved resolution of the pattern of a semiconductor device or the like is obtained.
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