Invention Grant
- Patent Title: Foldable support structure
- Patent Title (中): 可折叠支撑结构
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Application No.: US11307005Application Date: 2006-01-19
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Publication No.: US07170740B1Publication Date: 2007-01-30
- Inventor: Jen-Hao Liu , San-Yang Lo , Hong-Wen Lee
- Applicant: Jen-Hao Liu , San-Yang Lo , Hong-Wen Lee
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A foldable support structure suitable for a notebook is provided. The notebook includes a keyboard, a circuit board, and a support frame, disposed above the circuit board for carrying the edge of the keyboard. The support structure is disposed inside an opening of the support frame for supporting the bottom of the keyboard. The support structure and the support frame are fabricated as a whole. The support structure includes a flexibility section, a support section and a pedestal section. The flexibility section is connected to the support frame and the support section. The pedestal section is connected to the support section. The deformed flexibility section keeps the support section away from the circuit board. The support section has a support surface for supporting the keyboard. The pedestal section is suitable for connecting the circuit board such that a distance is kept between the support section and the circuit board.
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