A method of assembling multiple electronic components to a circuit board includes securing one electronic component to the circuit board, then, creating an association between that electronic component and an environmental condition recorder. The method further includes recording data from the environmental condition recorder. The recorded data indicates exposure of the secured electronic component to an environmental condition over time. The method also includes determining, based on the stored data, whether the secured electronic component is suitable for exposure to conditions associated with securing a second electronic component to the circuit board.