Invention Grant
US07164113B2 Solid state imaging device with semiconductor imaging and processing chips
有权
具有半导体成像和处理芯片的固态成像装置
- Patent Title: Solid state imaging device with semiconductor imaging and processing chips
- Patent Title (中): 具有半导体成像和处理芯片的固态成像装置
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Application No.: US10676136Application Date: 2003-09-30
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Publication No.: US07164113B2Publication Date: 2007-01-16
- Inventor: Kazuyuki Inokuma , Toshiya Fujii , Takumi Yamaguchi , Shigetaka Kasuga
- Applicant: Kazuyuki Inokuma , Toshiya Fujii , Takumi Yamaguchi , Shigetaka Kasuga
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2002-287609 20020930
- Main IPC: H01L27/00
- IPC: H01L27/00

Abstract:
The present invention provides a small, high-performance imaging device and its application to products at low cost by preventing noise superimposed on a timing pulse feed line from affecting the output of an imaging chip. The imaging device includes two chips: an imaging chip 101 including a sensor 102 and an image processing chip 106 including an image processing circuit 110. The transistors of all circuits in the imaging chip 101 are formed as either nMOS or pMOS transistors. The imaging chip 101 is stacked on the image processing chip 106.
Public/Granted literature
- US20040095495A1 Solid state imaging device and equipment using the same Public/Granted day:2004-05-20
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