Invention Grant
US07119343B2 Mechanical oscillator for wafer scan with spot beam 失效
机械振荡器,用于具有点光束的晶圆扫描

Mechanical oscillator for wafer scan with spot beam
Abstract:
The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a first link and a second link rigidly coupled to one another at a first joint, wherein the first link and second link are rotatably coupled to a base portion by the first joint, therein defining a first axis. An end effector, whereon the substrate resides, is coupled to the first link. The second link is coupled to a first actuator via at least second joint. The first actuator is operable to translate the second joint with respect to the base portion, therein rotating the first and second links about the first axis and translating the substrate along a first scan path in an oscillatory manner. A controller is further operable to maintain a generally constant translational velocity of the end effector within a predetermined scanning range.
Public/Granted literature
Information query
Patent Agency Ranking
0/0