发明授权
- 专利标题： Heat dissipation assembly
- 专利标题（中）： 散热组件
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申请号： US10946663申请日： 2004-09-21
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公开(公告)号： US07110261B2公开(公告)日： 2006-09-19
- 发明人: Hsieh Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
- 申请人： Hsieh Kun Lee , Cheng-Tien Lai , Shi-Wen Zhou
- 申请人地址： TW Taipei Hsien
- 专利权人： Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人： Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人地址： TW Taipei Hsien
- 代理商 Wei Te Chung
- 优先权： CN200320118519U 20031121
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.
公开/授权文献
- US20050111197A1 Heat dissipation assembly 公开/授权日：2005-05-26
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