Invention Grant
- Patent Title: Micro-relay
- Patent Title (中): 微型继电器
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Application No.: US10492642Application Date: 2003-07-31
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Publication No.: US07102473B2Publication Date: 2006-09-05
- Inventor: Kouji Sakai , Hideki Enomoto , Naoki Okumura , Tsutomu Shimomura , Masami Hori
- Applicant: Kouji Sakai , Hideki Enomoto , Naoki Okumura , Tsutomu Shimomura , Masami Hori
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Works, Ltd.
- Current Assignee: Matsushita Electric Works, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2002-223845 20020731
- International Application: PCT/JP03/09724 WO 20030731
- International Announcement: WO2004/017349 WO 20040226
- Main IPC: H01H62/07
- IPC: H01H62/07

Abstract:
This micro relay comprises a body 1, a cover 4, an armature block 3. The body 1, which is made of silicon or glass, has an electromagnetic mechanism 2. The cover 4 is also made of silicon or glass. The armature block 3 is made of silicon. The armature block 3 is composed of an armature base 30 and a frame 31. The frame 31 surrounds an entire circumference of the armature base 30 and supports the armature base 30 pivotally. The armature base 30 is cooperative with a magnetic material 32 on a surface of the armature base 30 to define an armature 300. A fixed contacts 14A, 14B, 15A, 15B and movable contacts 33A, 33B are selectively closed and opened by a pivot motion of the armature 300. And, the frame 31 is directly bonded over its entire circumference to a periphery 19 of the body 1 and to a periphery 41 of the cover 4 to define a sealed space surrounded by the frame 31 and closed between the body 1 and the cover 4 for accommodating the armature 300 and the fixed contacts and the movable contacts.
Public/Granted literature
- US20050156696A1 Micro-relay Public/Granted day:2005-07-21
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