Invention Grant
- Patent Title: Copper based sintered contact material and double-layered sintered contact member
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Application No.: US10762237Application Date: 2004-01-23
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Publication No.: US07087318B2Publication Date: 2006-08-08
- Inventor: Takemori Takayama , Tetsuo Ohnishi , Yoshikiyo Tanaka , Keiichi Maeda , Kan'ichi Sato
- Applicant: Takemori Takayama , Tetsuo Ohnishi , Yoshikiyo Tanaka , Keiichi Maeda , Kan'ichi Sato
- Applicant Address: JP
- Assignee: Komatsu Ltd.
- Current Assignee: Komatsu Ltd.
- Current Assignee Address: JP
- Agency: Rader, Fishman & Grauer, PLLC
- Priority: JP2001-212172 20010712; JP2002-135275 20020510
- Main IPC: B32B15/20
- IPC: B32B15/20 ; B32B15/01 ; B32B15/18 ; B22F7/00 ; C22C1/05

Abstract:
With the objectives of alleviating the property of attacking on the mating member by scratching-off of local agglutinates on the sliding contact surface, achieving improved wear resistance, and achieving improved seizure resistance through restraint of frictional heat generation by a hard phase, a copper based sintered contact material contains shock-resistant ceramics in an amount of 0.05 to less than 0.5 wt % as non-metallic particles composed of one or more substances selected from pulverized oxides, carbides and nitrides. The shock-resistant ceramics are comprised of SiO2 and/or two or more substances selected from SiO2, Al2O3, LiO2, TiO2 and MgO.
Public/Granted literature
- US20040149081A1 Copper based sintered contact material and double-layered sintered contact member Public/Granted day:2004-08-05
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