Invention Grant
- Patent Title: Dynamic class packaging
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Application No.: US10001085Application Date: 2001-10-31
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Publication No.: US07076768B2Publication Date: 2006-07-11
- Inventor: Chia-Hsin Li , Brian Chan
- Applicant: Chia-Hsin Li , Brian Chan
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Main IPC: G06F9/44
- IPC: G06F9/44

Abstract:
Methods and computer readable media for a software tool capable of subdividing programs into autonomous modules, where the modules enable a feature of the program, are provided. One exemplary method includes a computer implemented method for identifying modules of an executable program. The method begins with initiating the executable program. Then, the executable program is monitored as it is running. The monitoring of the executable program further includes, identifying interrelated classes for each of the modules where each of the modules correspond to a feature functionality of the executable program. Also included in the monitoring is generating a data structure for each module as the executable program is running. Here, the data structure defines the classes for each feature functionality.
Public/Granted literature
- US20030101445A1 Dynamic class packaging Public/Granted day:2003-05-29
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