A magnetic material having a low coefficient of thermal expansion of 11.5×10−6/K or less is used for forming at least one of a lower shield or an upper shield. A laminated film comprising a layer of the magnetic material having a low coefficient of thermal expansion of 11.5×10−6/K or less, and an 80 wt % NiFe alloy layer, is used for forming at least one of the lower shield and the upper shield. Thus, the thin film magnetic head having reduced after-record noise and reduced thermal protrusion can be obtained.