Systems and methods for thermal management of diode-pumped solid-state lasers
Abstract:
A solid-state laser system includes a solid-state laser having a laser gain medium and at least one pumping diode. The system also includes a thermal management system capable of placing a coolant in thermal communication with the solid-state laser such that the coolant can carry heat away from the solid-state laser. The thermal management system is then capable of rejecting the heat carried away by the coolant to a fluid at an ambient temperature, where the coolant can be at a temperature between 40° C. and 80° C. when the thermal management system rejects the heat. Advantageously, the thermal management system of the present invention can include reject the heat to a fluid comprising, for example, air or water. As such, the thermal management system does not require separate cooling of the fluid carrying the heat away from the coolant.
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