Invention Grant
- Patent Title: Method and apparatus for measuring physical properties of micro region
- Patent Title (中): 用于测量微区物理性质的方法和装置
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Application No.: US10467303Application Date: 2001-02-28
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Publication No.: US07022988B2Publication Date: 2006-04-04
- Inventor: Yoshifumi Taniguchi , Mikio Ichihashi , Masanari Kouguchi
- Applicant: Yoshifumi Taniguchi , Mikio Ichihashi , Masanari Kouguchi
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Dickstein Shapiro Morin & Oshinsky LLP
- International Application: PCT/JP01/01484 WO 20010228
- International Announcement: WO02/068944 WO 20020906
- Main IPC: H01J37/26
- IPC: H01J37/26

Abstract:
A method and apparatus for measuring the physical properties of a micro region measures the two-dimensional distribution of stress/strain in real time at high resolution and sensitivity and with a high level of measuring position matching. A sample is scanned and irradiated with a finely focused electron beam (23, 26), and the displacement of position of a diffraction spot (32, 33) is measured by a two-dimensional position-sensitive electron detector (13). The displacement amount is outputted as a voltage value that is then converted into the magnitude of the stress/strain according to the principle of a nano diffraction method, and the magnitude is displayed in synchronism with a sample position signal.
Public/Granted literature
- US20040061053A1 Method and apparatus for measuring physical properties of micro region Public/Granted day:2004-04-01
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