Invention Grant
US07022402B2 Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto
有权
包含聚酰亚胺芯层和高温含氟聚合物粘合层的介电基材，以及与其相关的方法
- Patent Title: Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto
- Patent Title (中): 包含聚酰亚胺芯层和高温含氟聚合物粘合层的介电基材，以及与其相关的方法
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Application No.: US10620089Application Date: 2003-07-14
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Publication No.: US07022402B2Publication Date: 2006-04-04
- Inventor: Philip Roland Lacourt
- Applicant: Philip Roland Lacourt
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: B32B1/00
- IPC: B32B1/00 ; B32B7/12 ; B32B15/02 ; B32B27/08
Abstract:
An asymmetric multi-layer insulative film of improved internal adhesive strength is made by combining a layer of polyimide and a high-temperature bonding layer, the high-temperature bonding layer being derived from a high temperature base polymer made of poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (PFA) and optionally blended with from 0–60 weight percent poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP). The polyimide and high-temperature bonding layer laminate optionally also contains a layer of unsintered, partially sintered, or totally sintered polytetrafluoroethylene (PTFE) bonded directly to the high-temperature bonding layer. In addition, the polyimide high-temperature bonding layer laminate may be adhered to a poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) adhesive primer layer to more effectively bond the polyimide core layer to the high-temperature bonding layer. This type of primer layer may also be used as a polyimide-to-metal bonding layer to assist bonding of the polyimide to a metal wire or metal layer.
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