Invention Grant
- Patent Title: High-frequency relay having a conductive and grounding base covering at least a bottom surface of a body
- Patent Title (中): 高频继电器具有覆盖主体的至少底面的导电和接地基座
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Application No.: US10151969Application Date: 2002-05-22
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Publication No.: US06960972B2Publication Date: 2005-11-01
- Inventor: Akio Nakamura , Yoshinori Kurata , Hirofumi Saso
- Applicant: Akio Nakamura , Yoshinori Kurata , Hirofumi Saso
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Component Limited
- Current Assignee: Fujitsu Component Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2001-328209 20011025
- Main IPC: H01H9/12
- IPC: H01H9/12 ; H01H45/04 ; H01H45/10 ; H01H50/02 ; H01H50/04 ; H01H50/10 ; H01H50/18 ; H01H51/22
Abstract:
A high-frequency relay comprises a body containing a contact unit having at least one contact terminal protruding from a bottom surface of the body, contact states switched according to energization of a coil and a base covering at least a bottom surface of the body. The contact unit is connected with at least one contact terminal. The base has a grounding function and includes a conductive layer.
Public/Granted literature
- US20030080840A1 High-frequency relay having a conductive and grounding base covering at least a bottom surface of a body Public/Granted day:2003-05-01
Information query
