Invention Grant
- Patent Title: Electroconductive low thermal expansion ceramic sintered body
- Patent Title (中): 导电低热膨胀陶瓷烧结体
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Application No.: US10296516Application Date: 2001-06-04
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Publication No.: US06953538B2Publication Date: 2005-10-11
- Inventor: Fumiaki Takahashi , Tetsuro Nose , Masashi Nakabayashi
- Applicant: Fumiaki Takahashi , Tetsuro Nose , Masashi Nakabayashi
- Applicant Address: JP Tokyo
- Assignee: Nippon Steel Corporation
- Current Assignee: Nippon Steel Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenyon & Kenyon
- Priority: JP2000-168437 20000606; JP2000-324518 20001024
- International Application: PCT/JP01/04695 WO 20010604
- International Announcement: WO01/94272 WO 20011213
- Main IPC: C04B35/19
- IPC: C04B35/19 ; C03C10/12 ; C03C14/00 ; H01B1/08

Abstract:
An electroconductive low thermal expansion ceramic sintered body is disclosed which containing a β-eucryptite phase in a quantity of not less than 75 vol. % and not more than 99 vol. % and having an absolute value of thermal expansion coefficient of not more than 1.0×10−7/K at a temperature of 0° C. to 50° C., a volumetric specific resistance of not more than 1.0×107 Ω·cm, and a specific rigidity of not less than 40 GPa/g/cm3.
Public/Granted literature
- US20030139280A1 Electrically conductive ceramic sintered compact exhibiting low thermal expansion Public/Granted day:2003-07-24
Information query
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