发明授权
- 专利标题: Surface mounter for mounting components
- 专利标题(中): 表面安装器用于安装组件
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申请号: US10460001申请日: 2003-06-12
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公开(公告)号: US06944943B2公开(公告)日: 2005-09-20
- 发明人: Tae-yeon Cho , Seong-i Lee
- 申请人: Tae-yeon Cho , Seong-i Lee
- 申请人地址: KR
- 专利权人: Samsung Techwin Co., Ltd
- 当前专利权人: Samsung Techwin Co., Ltd
- 当前专利权人地址: KR
- 代理机构: St. Onge Steward Johnston & Reens LLC
- 优先权: KR10-2002-0032847 20020612
- 主分类号: H05K13/02
- IPC分类号: H05K13/02 ; G02F1/13 ; H05K13/04 ; H05K13/08 ; H05K3/30
摘要:
A surface mounter includes: a component supply unit in which a plurality of components to be mounted are placed; a head unit which mounts a component on a circuit board by lifting the component from the component supply unit with suction; and a transfer unit including a carry-in portion with a single distribution lane, a mounting portion with dual working lanes, and a carry-out portion with a single carry-out lane, wherein a circuit board is transferred along the distribution lane and distributed to the mounting portion, components are mounted on the circuit board stopped at a position of the mounting portion, and the circuit board with the components mounted thereon is transferred out of the transfer unit along the carry-out lane. In the surface mounter, a number of circuit boards can be distributed to dual working lanes via a single distribution lane, not via common dual carry-in lanes, at higher working speed, so that working efficiency is improved. In addition, the surface mounter occupies less space.
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