As shown in FIG. 2, a multi-layer structured exposure mask 1 of this embodiment is provided with a frame 20 made of glass, a silicon plate 15 provided on an under surface of the frame 20, a heat absorption mask 16 provided on an under surface of the silicon plate 15, a silicon plate 11 provided on an under surface of the heat absorption mask 16 and a stencil mask 14 provided on an under surface of the silicon plate 11. The stencil mask 14 is made up of a silicon substrate and is provided with a slit-shaped patterning opening 14a to form a resist pattern. The heat absorption mask 16 is made up of a silicon substrate coated with an SiN film and is provided with slit-shaped openings 16a shaped in almost the same way as the patterning openings 14a of the stencil mask 14. The opening 16a is shaped in such a size that will not block electron beams necessary to form a resist pattern as shown in FIG. 3(a). That is, a size of the opening 16a is equal to a size of the patterning opening 14a or a size of the opening 16a is a little larger Furthermore, the multi-layer structured exposure mask 1 of this embodiment is provided with a large opening 20a that penetrates the frame 20 and silicon plate 15 and exposes the area of the upper surface of the heat absorption mask 16 in which the openings 16a are formed. Furthermore, the multi-layer structured exposure mask 1 of this embodiment is provided with a hollow section 11a that penetrates the silicon plate 11 and exposes the area of the under surface of the heat absorption mask 16 in which the openings 16a are formed and the area of the upper surface of the stencil mask 14 in which the patterning openings 14a are formed. In the multi-layer structured exposure mask 1 of this embodiment, the patterning openings 14a of the stencil mask 14 and the openings 16a of the heat absorption mask 16 are aligned in the horizontal direction as shown in FIG. 3(a).