发明授权
- 专利标题: Surface joined multi-substrate liquid metal switching device
- 专利标题(中): 表面接合多基板液态金属开关装置
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申请号: US10738665申请日: 2003-12-16
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公开(公告)号: US06872903B2公开(公告)日: 2005-03-29
- 发明人: Tsutomu Takenaka , You Kondoh
- 申请人: Tsutomu Takenaka , You Kondoh
- 申请人地址: US CA Palo Alto
- 专利权人: Agilent Technologies, Inc.
- 当前专利权人: Agilent Technologies, Inc.
- 当前专利权人地址: US CA Palo Alto
- 优先权: JP2002-363674 20021216
- 主分类号: H01H61/01
- IPC分类号: H01H61/01 ; H01H1/08 ; H01H29/28 ; H01H29/30 ; H01H61/013 ; H01H29/00
摘要:
A device and manufacturing method are provided comprising first and second substrates comprising a main channel provided in at least one of the substrates and a first connecting channel provided in at least one of the substrates and in fluid communication with the main channel. The main channel comprising spaced apart electrodes and filling the main channel at least partially with liquid metal. The method further comprising a first heater substrate comprising a first suspended heater element in fluid communication with the first connecting channel with the first suspended heater element operable to cause a fluid non-conductor to separate the liquid metal and selectively interconnect the electrodes and surface joining the first, second, and first heater substrates.
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