Invention Grant
- Patent Title: Polymeric resin bonded magnets
- Patent Title (中): 聚合树脂粘结磁铁
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Application No.: US10238435Application Date: 2002-09-09
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Publication No.: US06872325B2Publication Date: 2005-03-29
- Inventor: Krisanu Bandyopadhyay , Kunj Tandon , Amit Chakrabarti
- Applicant: Krisanu Bandyopadhyay , Kunj Tandon , Amit Chakrabarti
- Applicant Address: US MA Pittsfield
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US MA Pittsfield
- Main IPC: B29C39/00
- IPC: B29C39/00 ; B29C45/00 ; H01F1/055 ; H01F1/057 ; H01F1/08 ; H01F1/113 ; H01F1/147 ; H01F1/153 ; H01F1/26 ; H01F1/37 ; H01F41/02 ; C04B35/04 ; H01F1/00

Abstract:
Briefly, in accordance with one embodiment of the present invention, a process for making a magnetic composite which comprises providing a polymeric resin and a magnetic powder, the magnetic powder having a mean particle size with a value for standard deviation that is less than the value for the mean particle size of the said magnetic powder, the said magnetic composite being made by mixing said magnetic powder with said polymeric resin and molding the said mixture into a desired shape and a size and said magnetic composite having a magnetic permeability between 30 and 50. In another embodiment the present invention is a composition for a magnetic composite comprising a polymeric resin and a magnetic powder, the said powder having a mean particle size with a value of standard deviation that is less than the value of the mean particle size of the magnetic powder, wherein said magnetic composite has a magnetic permeability between about 30 and about 50.
Public/Granted literature
- US20040045635A1 Polymeric resin bonded magnets Public/Granted day:2004-03-11
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