Non-cyanide copper plating process for zinc and zinc alloys

Invention Grant

US06827834B2 Non-cyanide copper plating process for zinc and zinc alloys 有权

Title translation: 锌和锌合金的非氰化物镀铜工艺

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Patent Title: Non-cyanide copper plating process for zinc and zinc alloys
Patent Title (中): 锌和锌合金的非氰化物镀铜工艺
Application No.: US10096411

Application Date: 2002-03-12
Publication No.: US06827834B2

Publication Date: 2004-12-07
Inventor: Ronald Stewart , Carl Steinecker
Applicant: Ronald Stewart , Carl Steinecker
Main IPC: C23C2802
IPC: C23C2802

Non-cyanide copper plating process for zinc and zinc alloys

Abstract:

The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article is first immersed in an aqueous nickel pyrophosphate solution and is then electroplated with a copper pyrophosphate solution. The method produces an adherent copper coating on the zinc or zinc alloy, which can be deformed without any loss of the copper coating.

Abstract(Chinese):

本发明包括在锌或锌合金制品上生产粘附铜涂层的方法，而不使用氰化物作为该方法的组分。锌或锌合金制品首先浸入焦磷酸镍水溶液中，然后用焦磷酸铜溶液电镀。该方法在锌或锌合金上产生粘附铜涂层，可以在不损失铜涂层的情况下变形。

Public/Granted literature

US20030183532A1 Non-cyanide copper plating process for zinc and zinc alloys Public/Granted day:2003-10-02

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