发明授权
- 专利标题: Zero thermal expansion material
- 专利标题(中): 零热膨胀材料
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申请号: US10189773申请日: 2002-07-08
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公开(公告)号: US06812178B2公开(公告)日: 2004-11-02
- 发明人: Tomoko Suzuki , Atsushi Omote , Jun Kuwata
- 申请人: Tomoko Suzuki , Atsushi Omote , Jun Kuwata
- 优先权: JP2001-211826 20010712; JP2002-150338 20020524
- 主分类号: C04B35495
- IPC分类号: C04B35495
摘要:
Using as a negative thermal expansion material a double oxide containing at least partly a compound represented by the chemical formula: RQ2O8 (wherein R is Zr, Hf or a tetravalent metallic element represented by a mixture system of these, and Q is a hexavalent metallic element selected from W and Mo), and using as a positive thermal expansion material a material containing at least partly a compound represented by the chemical formula: MQX4 (wherein M is Mg, Ca, Sr, Ba, Ra or a divalent metallic element represented by a mixture system of any of these, Q is a hexavalent metallic element selected from W and Mo, and X is an element selected from O and S), these are mixed preferably in a weight ratio of 1:1 and are synthesized to obtain a material whose coefficient of thermal expansion is substantially zero over a wide temperature range, i.e., a zero thermal expansion material. Using this zero thermal expansion material, high-precision and high-performance practical component parts can be obtained.
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