A lapping plate has photolithographically defined patterns that are electroplated to produce lands with well-defined channels. By choosing a particular geometry, the retention force is significantly reduced over prior art options, while still retaining a high land area fraction. In some versions, the material is electroplated onto sufficiently thin substrates to allow conformation to a curved vacuum chuck. This configuration provides a very large reduction in retraction force when compared to smooth, flat lapping plates. In addition, the substrate used to form the lapping plate has reduced thickness, and a vacuum chuck is used to pull the thin, flat lapping plate against it to define the curvature. This allows the lapping plate to be charged by a flat charging ring. The substrate used is typically glass and has been sputter-metallized on both sides. The resist is then patterned, leaving an exposed pattern in the metallization on both sides.