Invention Grant
- Patent Title: High-frequency module and mobile communication apparatus using the same
- Patent Title (中): 高频模块和使用其的移动通信设备
-
Application No.: US09903834Application Date: 2001-07-12
-
Publication No.: US06788958B2Publication Date: 2004-09-07
- Inventor: Koji Furutani , Norio Nakajima , Tetsuro Harada , Yoshiki Takada , Akihiro Ochii
- Applicant: Koji Furutani , Norio Nakajima , Tetsuro Harada , Yoshiki Takada , Akihiro Ochii
- Priority: JP2000-227631 20000727
- Main IPC: H04B138
- IPC: H04B138

Abstract:
A high-frequency module includes a diplexer, first and second high-frequency switches, a SAW duplexer, first and second LC filters functioning as first and second filters, and an SAW filter functioning as a third filter. The module defines a unit that integrates front-end sections of first to third communication systems, a digital cellular system (1.8 GHz band), a personal communication service (1.9 GHz band) and a global system for mobile communications (900 MHz band).
Public/Granted literature
- US20020032038A1 High-frequency module and mobile communication apparatus using the same Public/Granted day:2002-03-14
Information query