发明授权
US06650456B2 Ultra-high frequency interconnection using micromachined substrates 有权
使用微加工基板的超高频互连

  • 专利标题: Ultra-high frequency interconnection using micromachined substrates
  • 专利标题(中): 使用微加工基板的超高频互连
  • 申请号: US10120924
    申请日: 2002-04-11
  • 公开(公告)号: US06650456B2
    公开(公告)日: 2003-11-18
  • 发明人: Frank F. JuddYongqiang Shi
  • 申请人: Frank F. JuddYongqiang Shi
  • 主分类号: G02F103
  • IPC分类号: G02F103
Ultra-high frequency interconnection using micromachined substrates
摘要:
The present invention provides a device, a method of making the device, and a system incorporating the same. In one embodiment, the device includes a substrate that has first and second opposing surfaces and first and second thicknesses, wherein the second thickness is less than the first thickness, and the first surface is substantially planar. The device further includes a conductive trace having an input end and an output end and located over the first surface of the substrate, wherein at least one of the input end or output end is aligned with the second substrate thickness.
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