Invention Grant
US06606754B1 Supported hypo/hyperthermia pad 有权
支持低/高热垫

  • Patent Title: Supported hypo/hyperthermia pad
  • Patent Title (中): 支持低/高热垫
  • Application No.: US09542010
    Application Date: 2000-04-03
  • Publication No.: US06606754B1
    Publication Date: 2003-08-19
  • Inventor: Roland E. Flick
  • Applicant: Roland E. Flick
  • Main IPC: A47C2104
  • IPC: A47C2104
Supported hypo/hyperthermia pad
Abstract:
A first conformable material having a three-dimensional shape and a first hypothermia and/or hyperthermia device, used as a pad for sleeping, lying down, or sitting, to maintain a desired temperature to the contacting surface of a body to the pad.
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