A sleeve assembly for housing and protecting an electronic chip. The sleeve assembly includes a first sleeve member and a second sleeve member attached to the first sleeve member. The first sleeve member includes at least one substrate engaging member adapted to be inserted into an engaging member hole located on a substrate and at least one chip guiding member adapted to substantially correctly align an electronic chip with a socket when the electronic chip is inserted into the sleeve assembly. Additionally, the at least one engaging member and the at least one chip guiding member extend from a lower surface of the sleeve assembly. The sleeve assembly serves to protect the electronic chip from physical and electrostatic discharge damage during storage as well as after the electronic chip is mated with the socket.