发明授权
- 专利标题: High speed electronic assembly system and method
- 专利标题(中): 高速电子组装系统及方法
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申请号: US09745324申请日: 2000-12-21
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公开(公告)号: US06572702B1公开(公告)日: 2003-06-03
- 发明人: Gary T. Freeman , Ronald C. Lasky , Robert J. Balog , Joseph Belmonte , Thomas C. Prentice , Brian P. Prescott
- 申请人: Gary T. Freeman , Ronald C. Lasky , Robert J. Balog , Joseph Belmonte , Thomas C. Prentice , Brian P. Prescott
- 主分类号: B05C1100
- IPC分类号: B05C1100
摘要:
Aspects of the present invention are directed to methods and apparatus for producing substrates, including printed circuit boards, in production lines. In one aspect, the present invention provides a production system, a plurality of production lines, wherein machines from one of the lines may be used to replace machines in one of the other lines. In another aspect, the present invention provides a printing system for use in circuit board production lines. The printing system includes a first printer, a second printer and a transfer station. In another aspect, the present invention provides a dispensing system for use is production lines. The dispensing system includes a shuttle conveyor system that allows parallel processing on multiple circuit boards.
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