A curable composition comprising (A) a fluorinated amide compound, (B) a specific fluorinated organohydrogen-siloxane, (C) a platinum group compound, (D) an organosiloxane adhesion-imparting agent, (E) a silica powder having a BET specific surface area of at least 50 m2/g and (F) an organosilane or organosiloxane surface treatment agent for the silica powder provides a cured product endowed with excellent resistance to solvents, chemicals and heat, outstanding low-temperature properties, a low water-vapor permeability and outstanding electrical characteristics. When heated at a relatively low temperature for a relatively short period of time, the composition cures to a form having good adhesion and good durability of adhesion to base materials such as metals and plastics.