The present invention is to provide a thermal transfer sheet provided with a backface layer having high heat resistance and slipping characteristics by using a one-solution type coating solution adopting an environmentally acceptable general solvent without performing heat treatment such as aging. The thermal transfer sheet provided with the backface layer according to the present invention comprises a transfer ink layer which is melted or sublimated by heating on one surface of a substrate and the backface layer on the other surface of the substrate film, wherein the backface layer comprises a binder which comprises a polyamideimide resin and a polyamideimide silicone resin each having a grass transition temperatures of 200° C. or more based on differential thermal analysis at a specified mixing ratio, a polevalent metal salt of alkyl phosphate and filler at a specified mixing ratio. The thermal transfer sheet prevents the fusion of the film caused by the heat of a thermal head, has high lubricity and stands against high energy, thereby preventing refuses from adhering to the thermal head, enabling high speed printing and also the thermal transfer sheet has high printing stability and running stability.