发明授权
US06464778B2 Tungsten deposition process 有权
钨沉积工艺

  • 专利标题: Tungsten deposition process
  • 专利标题(中): 钨沉积工艺
  • 申请号: US09761881
    申请日: 2001-01-17
  • 公开(公告)号: US06464778B2
    公开(公告)日: 2002-10-15
  • 发明人: Wen Pin Chiu
  • 申请人: Wen Pin Chiu
  • 主分类号: C30B2514
  • IPC分类号: C30B2514
Tungsten deposition process
摘要:
A tungsten deposition process. A crystal growth step is carried out in a reaction chamber to form a tungsten crystal layer over a substrate using tungsten hexafluoride, silane and nitrogen as reactive gases. An intermediate step is conducted such that the supply of tungsten hexafluoride to the reaction chamber is cut but the supply of silane is continued. Furthermore, nitrogen is passed into the reaction chamber selectively. A main deposition step is finally conducted to form a tungsten layer over the tungsten crystal layer using tungsten hexafluoride, hydrogen and nitrogen as reactive gases.
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