发明授权
US06442307B1 Solder-packaged optical MEMs device and method for making the same
有权
焊料封装的光学MEM器件及其制造方法
- 专利标题: Solder-packaged optical MEMs device and method for making the same
- 专利标题(中): 焊料封装的光学MEM器件及其制造方法
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申请号: US09705350申请日: 2000-11-03
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公开(公告)号: US06442307B1公开(公告)日: 2002-08-27
- 发明人: Dustin W. Carr , Dennis S. Greywall , Sungho Jin , Flavio Pardo , Hyongsok Soh
- 申请人: Dustin W. Carr , Dennis S. Greywall , Sungho Jin , Flavio Pardo , Hyongsok Soh
- 主分类号: G02B626
- IPC分类号: G02B626
摘要:
In accordance with the invention, a MEMs mirror device comprises a mirror layer including a frame structure and at least one mirror movably coupled to the frame and an actuator layer including at least one conductive path and at least one electrode for moving the mirror. The mirror layer and the actuator layer are provided with metallization pads and are bonded together in lateral alignment and with predetermined vertical gap spacing by solder bonds between the pads. The device has utility in optical cross connection, variable attenuation and power gain equalization.
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