The invention relates to dielectric materials comprising films of R—Ge—Ti—O where R is selected from Zr and Hf, and to methods of making the same. The dielectric material preferably has the formula Rx—Gey—Tiz—Ow where 0.05≧x≦1, 0.05≧y≦1, 0.1≧z≦1, and 1≧w≦2, and x+y+z≅1, and more preferably, where 0.15≧x≦0.7, 0.05≧y≦0.3, 0.25≧z≦0.7, and 1.95≧w≦2.05, and x+y+z≅1. The invention is particularly useful in silicon-chip integrated circuit devices including a capacitor of a dynamic random access memory (DRAM) device.