Invention Grant
- Patent Title: High frequency dielectric heating system
- Patent Title (中): 高频介质加热系统
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Application No.: US09903659Application Date: 2001-07-13
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Publication No.: US06423955B1Publication Date: 2002-07-23
- Inventor: Glenn Craig Blaker , Terry Albert Enegren , Yiu Kwan (Eugene) Ho , Scott Ronald Spencer
- Applicant: Glenn Craig Blaker , Terry Albert Enegren , Yiu Kwan (Eugene) Ho , Scott Ronald Spencer
- Main IPC: H05B654
- IPC: H05B654

Abstract:
A method and apparatus for dielectric drying is disclosed wherein a load to be heated positioned on a carrier the bottom of which provides a secondary electrode is moved with the carrier a dielectric heating chamber having a primary electrode positioned above load when said load on said carrier is moved into an operative position in the chamber. The carrier and load are elevated into heating position and this movement simultaneously connects the secondary electrode to ground, so that when high frequency power is applied to the primary electrode the circuit is made to dielectrically heat the load.
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