A method for manufacturing an orifice plate with a plate material having a through hole arranged to become an orifice for discharging liquid comprises the steps of arranging a resin layer in a position corresponding to the through hole on the surface of a conductive substrate in a configuration corresponding to the through hole in a thickness corresponding at least to the lenght of the through hole, forming a metallic layer by means of electro-forming on the exposed surface of a portion of the conductive substrated corresponding to the plate material in a thickness corresponding to the thickness of the plate material in order to obtain the metallic layer in a state where the resin layer is filled in the through hole portion, applying water repellent resin to the surface of the metallic layer having the resin layer filled therein, peeling off the metallic layer from the conductive substrate together with the resin layer to obtain the plate material in a state where the through hole portion is filled with the resin layer, and removing by laser irradiation the resin layer portion of the plate material in a state where the resin layer is filled in the through hole portion having the water repellent layer coated on the surface in order to form the through hole.