Invention Grant
- Patent Title: Wire-discharge machining apparatus
- Patent Title (中): 放线加工机
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Application No.: US09613751Application Date: 2000-07-11
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Publication No.: US06396021B1Publication Date: 2002-05-28
- Inventor: Tatsushi Sato , Seiji Satou , Yoshikazu Ukai
- Applicant: Tatsushi Sato , Seiji Satou , Yoshikazu Ukai
- Priority: JP11-295218 19991018
- Main IPC: B23H100
- IPC: B23H100

Abstract:
A wire-discharge machining apparatus for machining a workpiece by generating discharges between a wire electrode and the workpiece. In machining, the apparatus can detect all portions where wire-breakage frequently occurs and strictly discriminate between a condition detected and a control result, achieving wire-breakage prevention. This wire-discharge machining apparatus has an evaluating device and a controller. The evaluating device measure cycles, frequencies, or ignition delay times of the discharges as a measured value, evaluates the dispersion of the measured values, and outputs an evaluation value. The controller controls machining conditions according to the evaluation value.
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