A semiconductor component includes, before molding, a lead frame, a semiconductor chip mounted on the lead frame, and bonding wires for connecting pads of the semiconductor chip to inner leads. This component is inserted between a lower mold and an upper mold having a mold cavity moving unit, and these molds are clamped. Thereafter, an inner space formed by these clamped molds is filled with resin to form a package. Particularly, before resin filling, the mold cavity moving unit is moved downward and presses upper portions of the bonding wires to regulate the wire height. In this state, the inner space of these molds is filled with the resin. Before the filling resin is cured, the mold cavity moving unit is returned to the upper surface position of the package to form a nonfilling space in these molds. Thereafter, the nonfilling space is filled with the resin. With these processes, before resin filling, the bonding wires are pressed by the mold cavity moving unit to regulate the wire height, thus preventing the bonding wires from being exposed to the package surface after molding.