An article is described, which includes a metal-based substrate, such as a superalloy; a dense, primary bond layer; and a spongy secondary bond layer. A thermal barrier coating is applied over the secondary bond layer. The spongy layer has a microstructure which includes an open network of interconnected pores. A process is also described. It includes the step of applying a spongy, metallic bond layer over the substrate, followed by the application of a thermal barrier coating. A dense, primary bond layer may optionally be applied before the application of the spongy layer.