Invention Grant
- Patent Title: Shock-absorbing device for notebook computer module
- Patent Title (中): 笔记本电脑模块的减震装置
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Application No.: US09376540Application Date: 1999-08-18
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Publication No.: US06252768B1Publication Date: 2001-06-26
- Inventor: Chin-Chi Lin
- Applicant: Chin-Chi Lin
- Priority: TW88209440 19990609
- Main IPC: G06F116
- IPC: G06F116

Abstract:
A shock absorbing device for a notebook computer module. The device comprises of a notebook computer module, a cooling/protective plate, and two springs. A first spring is installed between the notebook computer module and the cooling/protective plate that provides a force trying to separate the cooling/protective plate and the module. The cooling/protective plate has a hole that permits a fastening insert to pass through. A first end of the fastening insert protrudes outside the cooling/protective plate while a second end of the fastening insert fastens onto the notebook computer module. There is a second spring between the first end of the fastening insert and the cooling/protective plate. The second spring provides a force trying to draw the cooling/protective plate closer to the module.
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