发明授权
US06242797B1 Semiconductor device having pellet mounted on radiating plate thereof
失效
具有安装在其散热板上的颗粒的半导体器件
- 专利标题： Semiconductor device having pellet mounted on radiating plate thereof
- 专利标题（中）： 具有安装在其散热板上的颗粒的半导体器件
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申请号： US09059324申请日： 1998-04-13
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公开(公告)号： US06242797B1公开(公告)日： 2001-06-05
- 发明人: Seiji Ichikawa , Takeshi Umemoto , Toshiaki Nishibe , Kazunari Sato , Kunihiko Tsubota , Masato Suga , Yoshikazu Nishimura , Keita Okahira , Tatsuya Miya , Toru Kitakoga , Kazuhiro Tahara
- 申请人： Seiji Ichikawa , Takeshi Umemoto , Toshiaki Nishibe , Kazunari Sato , Kunihiko Tsubota , Masato Suga , Yoshikazu Nishimura , Keita Okahira , Tatsuya Miya , Toru Kitakoga , Kazuhiro Tahara
- 优先权： JP9-128758 19970519
- 主分类号： H01L2348
- IPC分类号： H01L2348
摘要：
A semiconductor device having a pellet mounted on a radiating plate thereof is disclosed. The radiating plate is formed in such a shape that a central portion thereof is positioned higher than both end portions thereof. A pellet is mounted on a lower face of the central portion of the radiating plate, and an upper face of the central portion of the radiating plate is exposed to the top of a resin member. Since the upper face of the central portion of the radiating plate which has the pellet mounted on the lower face thereof is exposed from the resin member, heat generated by the pellet can be radiated efficiently.
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