发明授权
US06232382B1 Saponified ethylene-vinyl acetate copolymer resin composition and laminate having a layer of said resin composition
有权
乙烯 - 乙酸乙烯酯共聚物树脂组合物和具有所述树脂组合物层的层压体
- 专利标题: Saponified ethylene-vinyl acetate copolymer resin composition and laminate having a layer of said resin composition
- 专利标题(中): 乙烯 - 乙酸乙烯酯共聚物树脂组合物和具有所述树脂组合物层的层压体
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申请号: US09164566申请日: 1998-10-01
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公开(公告)号: US06232382B1公开(公告)日: 2001-05-15
- 发明人: Kenji Ninomiya , Koji Kita , Makoto Kunieda
- 申请人: Kenji Ninomiya , Koji Kita , Makoto Kunieda
- 优先权: JP9-287809 19971002
- 主分类号: C08K504
- IPC分类号: C08K504
摘要:
The saponified ethylene-vinyl acetate copolymer (EVOH) resin composition of the present invention is a composition comprising a saponified ethylene-vinyl acetate copolymer (EVOH) (A) having an ethylene content of 20-60 mole percent and a saponification degree of not less than 90 mole percent, magnesium acetate or/and calcium acetate (B) as an essential component and at least one of acetic acid (C), a boron compound (D) and sodium acetate (E) as an optional component, and is characterized in that the contents of the respective components in said composition, relative to 100 parts by weight of EVOH (A), are as follows: magnesium acetate or/and calcium acetate (B) 0.001-0.02 part by weight on the metal basis; acetic acid (C) 0-0.05 part by weight; the boron compound (D) 0-1 part by weight on the boron basis; and sodium acetate (E) 0-0.1 part by weight on the metal basis; and that the weight loss when said composition is maintained at a temperature (T+70)° C. higher by 70 ° C. than the melting point T° C. of said EVOH (A) for 1 hour is not more than 10% by weight. The laminate of the present invention is characterized in that a layer of a thermoplastic resin is disposed at least one side of a layer consisting of the EVOH resin composition mentioned above.
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